Silex Microsystems shall exhibit at "IEEE-NEMS 2016"

Mar. 16, 2016

Silex Microsystems shall exhibit at "The 11th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS 2016)" which will be held at Matsushima Bay and Sendai MEMS City, Japan, 17-20 April, 2016.

Details are follows.

Details

Date for exhibition	18(Mon.) -20(Wed.), 2016
Venue	Taikanso, Matsushima

Contents

MEMS foundry ’Silex Microsystems’

• φ6",8"compatible MEMS foundry
• Unique TSV technology
  1) Sil-Via : For better thermal resistivity and higher density by applying all Si structure
  2) Met-Via / Met-Cap : For better yield by applying Cu hollow structure
  3) For low power loss by Glass Via structure
• Unique TGV technology : (for low power loss by Glass via structure)  
• PZT production technology with sol-gel method
• Unique implementation methodology : SmartBLOCK (A methodology to reduce time and cost by applying proprietary process library and short loop confirmation）

 

If you intend to visit the event, do not hesitate to stop by our booth.