We shall exhibit "MEMS SENSING & NETWORK SYSTEM 2016"

• World No.1 Pure Play MEMS Foundry dedicated for OEM
• Designated for MEMS Φ６“/ the latest φ８”volume production fab
• Original TSV technology "Sil-Via" "Met-Via" "Met-Cap"
• Original TGV technology for thinning MEMS device
• Launch of the manufacturing service in Semi-Custom Pressure Sensor ‘RocketMEMS’
• Establishment of PZT layer deposition by Sol-Gel method
• Mass Production of Micro Needle for Bio/ Medical application

We offer optimal process for your MEMS development and fabrication requests using our decades-long expertise and several fabrication processes.

[ Process Example ]

• Thin Film Deposition（Sputter、Evaporation、CVD、Electro Plating、ALD　etc.）
• Photolithography（Aligner、Stepper、EB etc.）
• Etching（Wet、Dry、Si Deep RIE（ICP）、Sand Blast　etc.）
• CMP（Planarization for thin layers and post-bonding etc.）
• Wafer Bonding（Room-temp bonding、Plasma bonding、Anodic bonding、Eutectic bonding etc.　）
• Ion Implant
• Annealing（Laser annealing、RTA、Thermal diffusion　etc.）
• Nanoimprint（Mold fabrication、Nanoimprinting services、Anti-sticking mold treatment、Technology consulting

• R&D Nano-meter-level exposure system "PhableR 100"
• “UV Nanoimprinting tool” for R&D application with low cost and easy to use design.
• All plastic versatile Spin processor “SPIN150i” capable for all spin process such as coating, etching, developing, cleaning and spin dry with chemical inert.  
• Mask Aligner, equipped with high quality UV Light Source and Exposure System by OAI who have an abundance of expertise in UV light source development, realizes for optimal Mask Aligner from R&D to production stage.