Silex Microsystems：MEMS foundry services (support documentation)

Foundry capability

Lithography

	6 inch	8 inch
Contact 1:1 Aligner	Front/Back side	Front/Back side
Alignment Accuracy	∼1µm, front side	∼1µm, front side
	∼2µm, back side	∼2µm, back side
Minimum Features	∼0.8µm, vacuum mode	∼0.8µm, vacuum mode
	∼3µm, proximity mode	∼3µm, proximity mode
Stepper 5:1 Aligner	Front side	Front/Back side
Alignment Accuracy	∼0.1µm	∼0.1µm, Front side
	-	∼0.3µm, Back side
Minimum Features	∼0.5µm	∼0.35µm
Resist Thicknesses	1∼10µm, >20µm Positive	1∼10µm Positive
	1∼10µm, >20µm Negative	1∼10µm Negative
BCB	available	-
Lift-Off	available	-
Spray Coating	available	-

 Plasma Etching

	6 inch	8 inch
DRIE	available	available
Dielectric Etching (SiO2, SiN, etc.)	available	available
Polysilicon Etching	available	available
Polymer Etching and Stripping	-	available
Metals	Al, AlCu, TiW	TiN, AlCu
Oxide ICP	available	-

 Plasma Deposition

	6 inch	8 inch
PECVD Oxide	available	available
PECVD Nitride	available	available
PECVD TEOS	-	available
SACVD Oxide	-	available

Wafer Bonding

	6 inch	8 inch
Silicon Fusion Bonding	available	available
Au-Si, Au-Sn Eutectic Bonding	available	available
Anodic Bondin	available	available
Thermo-compression Bonding	available	available
Adhesive Bonding	available	available
Alignment Accuracy: Wafer Pairs	<5um	<3um
Alignment Accuracy: Multi-wafer Stacks	<5um	<3um
DI Wafer Clean (Megasonic; Brush)	available	available
Controlled Ambient or Vacuum	available	available

Back End

	6 inch	8 inch
Automated Dicing	available	available
Au and Al Wire Bonding	available	available
Lapping for Wafer Thinning and Polishing	available	available
Epoxy and Solder Die Attach	available	available

Furnace Process

	6 inch	8 inch
Thermal Oxidations (900-1050℃)	Wet/Dry/Mixed	Wet/Dry/Mixed
Annealing Processes (densification, bond or forming gas)	available	available
Vacuum Anneal	available	-
Metal Sintering	available	available
RTP	available	available
Doping Processes Z (ion implantation, POCI)	available	available
LPCVD nitride (standard, low stress)	-	available
Ant-Reflective Coatings	available	-
LPCVD oxides (LTO, PSG, TEOS)	available	available
LPCVD Silicon	Amorphous, Poly, Fine-Grain Poly	Amorphous, Poly (in-situ P-doped poly coming)

Wet Etching

	6 inch	8 inch
Anisotropic silicon etching (KOH, TMAH)	available	-
Wet etching of dielectrics (i.e. different oxides and nitrides)	available	-
Vapour HF	available	-
Wet cleaning process (acid and solvent based)	-	available
Fully-automated Spin Solvent	-	available

Metalization

	6 inch	8 inch
Sputter Deposition	Al, Au, Cr, Cu, Ti, TiW, AlCu	Ti/TiN, Cu, W, AlN, Mo, AlCu
Evaporation	Au, Cr, Ni, Pt, Si, Sn, Ti	-
Electroplating	Au, Sn	Ni, Au, Cu, Sn Integrated Seed Layer Etch
Electroless Plating	Au, Ni	-

Metrology

	6 inich	8 inch
SEM with CD-Tool	available	available
Ellipsometer	available	available
Interferometer	available	available
Inspection Microscopes	available	available
CD Microscopes	available	available
White Light Interferometer	available	available
Surface Profiler	available	available
Film Stress Measurement	available	available
Sheet Resistance (4-point probe)	available	available
Surfscan	available	available
XRD	available	available

Testing

	6 inch	8 inch
Automated Probing	available	available
Automated Electrical Parametric Testing		available
Customer-specific Test Rig	available	available
Test Development (Prototyping and Volume Production)	available	available

Expertise in MEMS devices